TSMC (Taiwan Semiconductor Manufacturing Company), the world leader in semiconductor manufacturing, wants to be even more leader and that is why it has started to accelerate Research and Development (R&D) of its manufacturing process next generation at 2nm.
In this way, TSMC is not only currently the leader but also aims to move away quickly from the competition, and that is that the company has accelerated lithographic jumps in recent years compared to other top-tier manufacturers such as Samsung or Intel, and that is that Of course, TSMC has an R&D budget of around 16,000 million dollars, and that is that the company reinvests a large part of the profits and this is the result.
TSMC announced a couple of weeks ago that it would start production of its expected 5nm manufacturing process during the fourth quarter of 2020, where all the wafers already have owners. Shortly thereafter, during the first half of 2021, the company will begin trial production of its 3nm manufacturing process, while if nothing changes, mass production will arrive in 2022.
As far as 2nm is concerned, TSMC has just purchased the machinery needed to make wafers, machinery so expensive that the company will not review its capital spending this year. As for the production of the first 2nm wafers, there is no date yet, as the manufacturing process is still in its development phase.