Sony shows the interior of the PlayStation 5: Radiator with 7x heat pipes of copper and liquid metal

Almost a month after the launch of the console, Sony has finally shown the internal design of the PlayStation 5, and for the first time the company has not disappointed, and we can see how it has resorted to a huge aluminum radiator divided into two areas traversed by no less than 7x copper heat pipes and spiced up with a generous copper vapor chamber that helps cool the rest of the neighboring components such as memory or the SSD.

This radiator is cooled by a huge turbine fan with a double air inlet design (draws air on both sides) and is 120mm diameter x 45mm high, and the AMD SoC uses liquid metal as a thermal compound to help further reduce temperatures.

As a curiosity, the SSD is soldered to the console’s own motherboard, that is, the memory chips and the custom controller. As a second curiosity, the console has two holes where dust accumulates and allows it to be vacuumed very easily, which translates into greater maintenance in the face of future accumulation of dust and increased temperatures.

As a curiosity, the SSD is soldered to the console’s own motherboard, that is, the memory chips and the custom controller. As a second curiosity, the console has two holes where dust accumulates and allows it to be vacuumed very easily, which translates into greater maintenance in the face of future accumulation of dust and increased temperatures.

Finally, the 350W power supply is integrated into the chassis of the console itself, it has WiFi 802.11ax + Bluetooth 5.1 connectivity, the Blu-ray drive has a metal plate along with two layers of insulation to reduce the noise of the unit and avoid any noise or vibration when the disks rotate, and a well-kept secret is that they indicate that there is an M.2 port compatible with PCI-Express 4.0 units for future storage expansion, not bad if we take into account that the console would offer about 600 GB of usable space.

READ ALSO  Vacancy confirms that Sony is working on a new virtual reality headset
en_USEnglish
en_USEnglish