According to a Sony patent, referring to the cooling system of the PlayStation 5, it shows that the company would have had to resort to ” fluid metal” to make the temperatures of the console within safe ranges.
Although it may seem somewhat revolutionary, it is not, and is that more and more companies are turning to fluid metal to try to gain a few degrees of margin in their equipment and reduce excess temperature problems to the maximum, and a clear example It was Asus, which showed an automated system to add this compound to its latest gaming laptops.
However, when the amount of heat generated by the semiconductor chip increases, it becomes difficult to sufficiently cool the semiconductor chip due to the thermal resistance of the grease. In the semiconductor device of Patent Document 2, instead of grease, a metal that is liquefied by heat during operation of the semiconductor chip is used as a heat conductive material between the semiconductor chip and the radiator. When such a metal is used, the thermal resistance between the semiconductor chip and the radiator is lowered, and the cooling performance of the semiconductor chip can be improved.
In a structure in which a fluid metal is used as a heat conductive material, in order to sufficiently exert the cooling performance, it is possible to limit the range in which the heat conductive material spreads even when the posture change or vibration of the semiconductor device occurs. is important. Further, it is important that the force sufficiently acts on the semiconductor chip when the radiator is pressed against the semiconductor chip. That is, the adhesion between the semiconductor chip and the radiator is also important.https://patentscope.wipo.int/
Fluid metal is nothing more than a metallic thermal compound, which is “dangerous” to use if you do not know what it does since it conducts electricity, so it must be placed with great care on top of the graphics chip or the encapsulated/die of the CPU. Being metallic, it offers a very high thermal conductivity, which helps to transfer much faster the heat generated by silicon to the cooling system for dissipation.
One of the most popular fluid metal thermal compounds is Thermal Grizzly, specifically Conductonaut, with thermal conductivity of 73W / mK. To give us an idea, 1 gram of this thermal compound costs about $11.31, and compared to a very popular thermal paste compound, the Arctic MX-4, it costs $12.99 for 4 grams but offers a thermal conductivity of 8.5 W / mk, that is to say, its thermal conductivity is almost 10 times lower and it means that from one solution to another we can reduce temperatures by a couple of degrees.